The first enclosure compliant with the embeddedNUC ™ standard which features an innovative “Flexible Heat Conductor” (FHC) integrated cooling solution and is compatible with 1U embedded NUC enclosures.
- “Flexible Heat Conductor” (FHC)
- For PCB top side cooling
- Can expand and contract vertically
- Compensate for tolerances; optimizing surface contact
- Thermal dissipation up to 15W
- Compatible with 1U embedded NUC enclosures
Featuring an integrated cooling solution for PCB top side cooling which can expand and contract vertically to compensate for tolerances and optimise surface contact and provide thermal dissipation up to 15W. The new embeddedNUC ™ enclosure is based on the Schroff Interscale platform of cases. It consists of just three parts (body, top cover and front panel) and offers standard platform flexibility in dimensions, cut-outs, colours and printing etc. The IP30 rated EMC-shielded case is simple to assemble and is fixed in place with just two screws. Heat sinks for conduction cooling are integrated in the top cover. Pentair has developed and patented special thermally conductive elements in metal to transfer the heat from the processors to the case surface. These elements are variable in height so that they can stay in constant contact with processors of different heights. The dissipated heat is transferred consistently by conduction to the heat sinks and then passed to the environment by means of convection and radiation. Another benefit of direct heat dissipation is better processor performance and higher clock speeds.